TMS320F28335PGFA TEXAS INSTRUMENTS

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Level-3-260C-168 Human Resources
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Export Control Classification
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US ECCN: 3A991A2
More TMS320F28335 information
parameter
technical documentation
design and development
Support and Training
Package information
Package | Pin
LQFP (PGF) | 176
Operating temperature range (°C)
-40 to 85
Package Quantity | Package
40 | JEDEC tray (5+1)
Features of the TMS320F28335
High performance static CMOS technology
Up to 150MHz (6.67ns cycle time)
1.9V/1.8V core, 3.3V I/O design
High-performance 32-bit CPU (TMS320C28x)
IEEE 754 single-precision floating-point unit (FPU) (F2833x only)
16 × 16 and 32 × 32 MAC operation
16 x 16 Dual MACs
Harvard bus architecture
Fast Interrupt Response and Handling
Unified Memory Programming Model
Efficient code (using C/C++ and assembly language)
6-channel DMA controller (for ADC, McBSP, ePWM, XINTF and SARAM)
16-bit or 32-bit external interface (XINTF)
Address coverage over 2M × 16

on-chip memory
F28335, F28333, F28235: 256K × 16 Flash, 34K × 16 SARAM
F28334, F28234: 128K × 16 Flash, 34K × 16 SARAM
F28332, F28232: 64K × 16 Flash, 26K × 16 SARAM
1K × 16 ROM
Boot ROM (8K × 16)
With software boot mode (via SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
standard math table
Clock and System Control
on-chip oscillator
Watchdog Timer Module
GPIO0 to GPIO63 pin can be routed to one of eight external core interrupts
Peripheral Interrupt Extension (PIE) block supporting all 58 peripheral interrupts
128-bit security key/lock
Protect Flash/OTP/RAM Blocks
Prevent firmware reverse engineering
Enhanced Control Peripherals
Up to 18 PWM outputs
Up to 6 HRPWM outputs with MEP resolution up to 150ps
Up to 6 event capture inputs
Up to 2 quadrature encoder interfaces
Up to eight 32-bit timers (6 for eCAP, 2 for eQEP)
Up to nine 16-bit timers (6 for ePWM, 3 for XINTCTR)
Three 32-bit CPU timers
Serial Port Peripherals
Up to 2 CAN modules
Up to 3 SCI (UART) modules
Up to 2 McBSP modules (configurable as SPI)
an SPI module
1 Inter-Integrated Circuit (I2C) bus
12-bit ADC, 16 channels
80ns Slew Rate
2 × 8-channel input multiplexer
two sample and hold
single/synchronous conversion
internal or external reference
Up to 88 individually programmable multiplexed GPIO pins with input filtering
Supports JTAG boundary scan
IEEE Std 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
Advanced Debugging Features
Analysis and breakpoint functions
Real-time debugging with hardware
Development support includes
ANSI C/C++ compiler/assembler/linker
Code Composer Studio™ Integrated Development Environment
DSP/BIOS™ and SYS/BIOS
Digital Motor Control and Digital Power Software Libraries
Low power mode to save energy
Supports idle, standby, shutdown modes
Disable individual peripheral clocks
Byte order: little endian
Package options:
Lead-free, green packaging
176-Ball Plastic Ball Grid Array (BGA) [ZJZ]
179-Ball MicroStar BGA™ [ZHH]
179-Ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]
176-Pin Low Profile Quad Flatpack (LQFP) [PGF]
176-Pin Thermally Enhanced Low Profile Quad Flat Pack (HLQFP) [PTP]
Temperature options:
Answer: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
S: –40°C to 125°C (PTP, ZJZ)
Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 Qualified for Automotive Applications)
Description of TMS320F28335
Optimized for processing, sensing and actuation, C2000™ real-time microcontrollers improve closed-loop real-time control applications such as industrial motor drives, photovoltaic inverters and digital power supplies, electric vehicles and transportation, motor control, and sensing and signal processing performance. The C2000 family includes advanced performance MCUs and entry performance MCUs.

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications.

In this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232. A summary of the features of each device is provided in F2833x Device Comparison and F2823x Device Comparison.

C2000™ Real-Time Control Microcontroller (MCU) Getting Started Guide Covers all aspects of C2000 device development, from hardware to support resources. In addition to the main reference documentation, each section provides related links and resources to help users learn more about related information.

To learn more about C2000 MCUs, visit the C2000™ Real-Time Control MCUs page.

TMS320F2833x, TMS320F2823x Real-Time Microcontrollers
1 Features
• High-performance static CMOS technology
– Up to 150 MHz (6.67-ns cycle time)
– 1.9-V/1.8-V core, 3.3-V I/O design
• High-performance 32-bit CPU (TMS320C28x)
– IEEE 754 single-precision Floating-Point Unit
(FPU) (F2833x only)
– 16 × 16 and 32 × 32 MAC operations
– 16 × 16 dual MAC
– Harvard bus architecture
– Fast interrupt response and processing
– Unified memory programming model
– Code-efficient (in C/C++ and Assembly)
• Six-channel DMA controller (for ADC, McBSP,
ePWM, XINTF, and SARAM)
• 16-bit or 32-bit External Interface (XINTF)
– More than 2M × 16 address reach
• On-chip memory
– F28335, F28333, F28235:
256K × 16 flash, 34K × 16 SARAM
– F28334, F28234:
128K × 16 flash, 34K × 16 SARAM
– F28332, F28232:
64K × 16 flash, 26K × 16 SARAM
– 1K × 16 OTP ROM
• Boot ROM (8K × 16)
– With software boot modes (through SCI, SPI,
CAN, I2C, McBSP, XINTF, and parallel I/O)
– Standard math tables
• Clock and system control
– On-chip oscillator
– Watchdog timer module
• GPIO0 to GPIO63 pins can be connected to one of
the eight external core interrupts
• Peripheral Interrupt Expansion (PIE) block that
supports all 58 peripheral interrupts
• 128-bit security key/lock
– Protects flash/OTP/RAM blocks
– Prevents firmware reverse-engineering
• Enhanced control peripherals
– Up to 18 PWM outputs
– Up to 6 HRPWM outputs with 150-ps MEP
resolution
– Up to 6 event capture inputs
– Up to 2 Quadrature Encoder interfaces
– Up to 8 32-bit timers
(6 for eCAPs and 2 for eQEPs)
– Up to 9 16-bit timers
(6 for ePWMs and 3 XINTCTRs)
• Three 32-bit CPU timers

• Serial port peripherals
– Up to 2 CAN modules
– Up to 3 SCI (UART) modules
– Up to 2 McBSP modules (configurable as SPI)
– One SPI module
– One Inter-Integrated Circuit (I2C) bus
• 12-bit ADC, 16 channels
– 80-ns conversion rate
– 2 × 8 channel input multiplexer
– Two sample-and-hold
– Single/simultaneous conversions
– Internal or external reference
• Up to 88 individually programmable, multiplexed
GPIO pins with input filtering
• JTAG boundary scan support
– IEEE Standard 1149.1-1990 Standard Test
Access Port and Boundary Scan Architecture
• Advanced debug features
– Analysis and breakpoint functions
– Real-time debug using hardware
• Development support includes
– ANSI C/C++ compiler/assembler/linker
– Code Composer Studio™ IDE
– DSP/BIOS™ and SYS/BIOS
– Digital motor control and digital power software
libraries
• Low-power modes and power savings
– IDLE, STANDBY, HALT modes supported
– Disable individual peripheral clocks
• Endianness: Little endian
• Package options:
– Lead-free, green packaging
– 176-ball plastic Ball Grid Array (BGA) [ZJZ]
– 179-ball MicroStar BGA™ [ZHH]
– 179-ball New Fine Pitch Ball Grid Array
(nFBGA) [ZAY]
– 176-pin Low-Profile Quad Flatpack (LQFP)
[PGF]
– 176-pin Thermally Enhanced Low-Profile Quad
Flatpack (HLQFP) [PTP]
• Temperature options:
– A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
– S: –40°C to 125°C (PTP, ZJZ)
– Q: –40°C to 125°C (PTP, ZJZ)
(AEC Q100 qualification for automotive
applications)

2 Applications
• Advanced driver assistance systems (ADAS)
– Medium/short range radar
• Building automation
– HVAC motor control
– Traction inverter motor control
• Factory automation & control
– Automated sorting equipment
– CNC control
• Grid infrastructure
– Central inverter
– String inverter
• Hybrid, electric & powertrain systems
– Inverter & motor control
– On-board (OBC) & wireless charger
• Motor drives
– AC-input BLDC motor drive
– Servo drive control module
• Power delivery
– Industrial AC-DC

3 Description
C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop
performance in real-time control applications such as industrial motor drives; solar inverters and digital power;
electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes
the Premium performance MCUs and the Entry performance MCUs.
The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234,
and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control
applications.
Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234,
and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of
features for each device.
The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all
aspects of development with C2000 devices from hardware to support resources. In addition to key reference
documents, each section provides relevant links and resources to further expand on the information covered.
To learn more about the C2000 MCUs, visit the C2000™ real-time control MCUs page.

Package Information
PART NUMBER(1) PACKAGE BODY SIZE
TMS320F28335ZAY  nFBGA (179) 12.0 mm × 12.0 mm
TMS320F28334ZAY  nFBGA (179) 12.0 mm × 12.0 mm
TMS320F28234ZAY  nFBGA (179) 12.0 mm × 12.0 mm
TMS320F28232ZAY  nFBGA (179) 12.0 mm × 12.0 mm
TMS320F28335ZHH  BGA MicroStar (179) 12.0 mm × 12.0 mm
TMS320F28334ZHH  BGA MicroStar (179) 12.0 mm × 12.0 mm
TMS320F28332ZHH  BGA MicroStar (179) 12.0 mm × 12.0 mm
TMS320F28235ZHH  BGA MicroStar (179) 12.0 mm × 12.0 mm
TMS320F28234ZHH  BGA MicroStar (179) 12.0 mm × 12.0 mm
TMS320F28232ZHH  BGA MicroStar (179) 12.0 mm × 12.0 mm
TMS320F28335ZJZ  BGA (176) 15.0 mm × 15.0 mm
TMS320F28334ZJZ  BGA (176) 15.0 mm × 15.0 mm
TMS320F28332ZJZ  BGA (176) 15.0 mm × 15.0 mm
TMS320F28235ZJZ  BGA (176) 15.0 mm × 15.0 mm
TMS320F28234ZJZ  BGA (176) 15.0 mm × 15.0 mm
TMS320F28232ZJZ  BGA (176) 15.0 mm × 15.0 mm
TMS320F28335PGF  LQFP (176) 24.0 mm × 24.0 mm
TMS320F28334PGF  LQFP (176) 24.0 mm × 24.0 mm
TMS320F28333PGF  LQFP (176) 24.0 mm × 24.0 mm
TMS320F28332PGF  LQFP (176) 24.0 mm × 24.0 mm

Package Information (continued)
PART NUMBER(1) PACKAGE BODY SIZE
TMS320F28235PGF LQFP (176) 24.0 mm × 24.0 mm
TMS320F28234PGF LQFP (176) 24.0 mm × 24.0 mm
TMS320F28232PGF LQFP (176) 24.0 mm × 24.0 mm
TMS320F28335PTP HLQFP (176) 24.0 mm × 24.0 mm
TMS320F28334PTP HLQFP (176) 24.0 mm × 24.0 mm
TMS320F28332PTP HLQFP (176) 24.0 mm × 24.0 mm
TMS320F28235PTP HLQFP (176) 24.0 mm × 24.0 mm
TMS320F28234PTP HLQFP (176) 24.0 mm × 24.0 mm
TMS320F28232PTP HLQFP (176) 24.0 mm × 24.0 mm